Combo lids

The solder seal lid, preferred by the semiconductor industry for high reliability and hermetic package sealing, is known as the Combo-Lid TM. The lids have a base material of either Kovar™ or Alloy 42, are plated with nickel and gold, and have a gold tin eutectic frame attached to the lid. Hi-Rel Combo lids TM are also made of Alloy 42 or Kovar but have a multi-layer plating process (Ni/Au/Ni/Au) which has enhanced performance of packages due to improving their resistance to moisture and corrosion.

Ceramic lids

Ceramic lids can be used on various multilayer packages but primarily with cerquad or cerpac style packages. They are available in a variety of shapes, sizes and thickness. For hermetic packages, a high temperature glass seal is required. When hermeticity is not a factor, or a low sealing temperature is required, a B-staged epoxy seal is acceptable. Ceramic lids are available opaque or with window options for EPROM applications.

ESM has a wide range of combo lids TM and ceramic lids available to fit most packages. Please call us with your requested lid part number or with your package seal ring inside and outside dimensions and we will suggest a lid for your application and package.