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Ceramic Leaded Chip Carriers

 

Flat Pack J-Bend Leaded Chip Carrier (CQFJ) Quad Flat Pack (CQFP)

Leaded Chip Carriers are also known as Flat Packs, Quad Flat Packs (CQFP), and J-Bend Leaded Chip Carriers (CQFJ). Flat Packs are usually found in lower lead counts; 8-28 leads, have small body outlines, are lightweight, have parallel leads on two sides of the package, and are commonly used in High Reliability applications for military airborne equipment. J-Bend Lead Chip Carriers and Quad Flat Packs are usually found in higher lead counts; greater than 24 leads, have leads on all four sides of the package, are hermetically sealed, and commonly used for surface mount applications or socketing. The leads are flat, gull-wing or J-Bend configured and depending on the package, lead spacing can be .015, .020, .025, and .050 inches.

 
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