The SOIC package is a surface mounted device, designed to replicate the footprint of their plastic counter part, commonly used for small quantity, quick turn assembly and test. The SOIC package is a rectangular "Dual In-line" style ceramic package, constructed of glass-ceramic composite material with an embedded gold-plated kovar lead frame and die attach pad. The body sizes are typically smaller than a standard package, are on a .050" lead spacing, typically come in lead counts ranging from 8-24 leads, have a gull-wing lead configuration, and can be sealed with an epoxy perform to a ceramic or plastic lid.