The standard Side Braze package, commonly known as a "DIP", consists of two rows of leads with .100 inch spacing brazed onto the sides of the ceramic. The row spacing varies from lead count, but can come in .300, .400, .600 and .900 inch wide configurations. The DIP is widely used due to its reliability, high performance, and ease of use. They can be mounted on a PC board with socket, manual or automated equipment. The packages have a hermetical seal using solder, epoxy or glass. As the lead count increases, the package size increases sharply thereby reducing the space efficiency and as the lead count increases, the internal lead traces also increase which increase the electrical characteristics of the package.